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Sponsor
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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
How Clean Should An Assembly Be To Be Functionally Good?
Establishing "how clean is clean" is not straightforward. No single answer will suffice; it is finding the ideal balance between the effects of electricity and humidity on a circuit that may be either high or low voltage, high or low frequency, and long or short warranty.
Ascentech LLC - GEN3
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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