Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Optimizing an LED Curing System

An Optimized LED Curing System is Essential for Process Efficiency LED curing lights continue to evolve as a replacement for industry-standard mercury-arc lamps. LED curing is attracting attention based on promises of lower operating costs, longer life, cooler curing, and "green" attributes.

Dymax Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura