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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Solder Paste Evaluation Screening Procedure
Numerous studies have shown that greater than 60% of end line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. Learn more in this white paper by Indium Corporation technology expert, Dr. Ron Lasky. Find out more...
Indium Corporation
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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