| Industry Paper |
Solder Paste Evaluation Screening Procedure
Numerous studies have shown that greater than 60% of end line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. Learn more in this white paper by Indium Corporation technology expert, Dr. Ron Lasky. Find out more...
Indium Corporation
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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