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Solder Paste Evaluation Screening Procedure
Numerous studies have shown that greater than 60% of end line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. Learn more in this white paper by Indium Corporation technology expert, Dr. Ron Lasky. Find out more...
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Optimize Your Process on Full SMT Demo Line
Validate your process in our demo lab. Our full line—printing, P&P, reflow, and AOI—is ready to optimize your profile and prove performance. Send us your boards to start.
Heller Industries
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