Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Alternative Pb-free Soldering Alloys

Paper discusses a variety of alternative Pb-free soldering alloys, including the mainstream SAC305, and compares against the benchmark eutectic SnPb solders. Several alloys show promise as replacement materials for targeted product applications. Learn more in this paper by technology expert, Sehar Samiappan.

Indium Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura