circuitnet
Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Optimal Membrane Switch Design For High Reliability Applications

One style of low-profile keypad assembly is the conventional flexible membrane keypad where the switchcircuitry is screen-printed. Silver conductive polymer inks are printed onto 1.25 mm (0.005 inches) polyester sheets. Two opposing polyester circuit layers are separated by a thin adhesive/polyester layer with a hole at the switch location. Read more ...
Epec Engineered Technologies
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH