Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Printed Circuit Board Surface Finishes - Advantages and Disadvantages

Anyone involved within the circuit board industry understand that PCB's have copper finishes on their surface. It is important to select the appropriate surface finish for your project by considering the options while factoring in performance requirements and material costs.

Epec Engineered Technologies

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura