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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
High-Reliability Pb-Free, Halogen-Free Solder Materials
Traditional SAC alloys don't offer the reliability required for some of today's most demanding applications, but a newly developed Pb-free alloy delivers. Find out how you can have superb reliability in an environmentally-compliant formula. Read more.
Henkel Corporation
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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