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| Industry Paper |
Flip Chip Assemblies with Underfill Encapsulants
The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.
Master Bond Inc.
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Optimize Your Process on Full SMT Demo Line
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Heller Industries
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