Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Epoxy Adhesive Films and Preforms for Electronics Manufacturing

Film adhesives are an alternative to liquid adhesives. Read
more about the advantages that these unique epoxies offer and why they are
often preferred over their conventional counterparts. If your application
involves a large surface to be joined or if squeeze out may pose a problem,
download this white paper today.

Master Bond Inc.

Complete the form below to download this technical paper.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura