| Sponsor |
|
AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
|
|
Ask the Experts Member |
|
|
Achref Jebali
Senior Process Engineer
Meatec Inc.
|
With 15 years of experience in PCB assembly, I served as a member of the expert cell in a multinational French company, contributing to process optimization and technical problem-solving.
Achref Jebali has submitted responses to the following questions.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|