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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Umit Aslantas
Sr. Manufacturing Engineer
Makersan LTD Co.
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Umit has been a PCBA production engineer for over 10 years. He is experienced in screen printing, pick and place, reflow profiling, AOI, and conformal coating. He also has knowledge of potting and bonding processes such as epoxy and silicon in electronic production and assembly.
Umit Aslantas has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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