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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
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Ask the Experts Member |
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Alex Hernandez
Process Engineer
Prime EMS
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Alex has been working in the electronic industry since February 2012. He started as a test technician and moved to SMT technician for the past seven years and helped develop/improve all processes for SMT, Reflow, AOI, Wave, Selective Solder, Cleaning, Post Wave, and Conformal Coating.
Alex Hernandez has submitted responses to the following questions.
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