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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Alex Hernandez
Process Engineer
Prime EMS
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Alex has been working in the electronic industry since February 2012. He started as a test technician and moved to SMT technician for the past seven years and helped develop/improve all processes for SMT, Reflow, AOI, Wave, Selective Solder, Cleaning, Post Wave, and Conformal Coating.
Alex Hernandez has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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