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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Prajin Kumar M
Component Engineering Manager
Flex
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14 Years with wide-ranging experience and leading operations involving manufacturing environments. Implementing continuous process improvement to minimize waste and reduce cost while maximizing quality and yield. Areas of expertise: component engineering, engineering change management obsolescence/lifecycle management, people management training, and mentoring.
Prajin Kumar M has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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