Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

David Molyneux

Sr. Process Engineer

TT Electronics

David has 30 years of experience in electronics contract manufacturing, specializing in SMT. Extensive experience with pick and place, reflow profiling, screen printing, SPI, X-ray, stencil design, new equipment selection and validation, complex process debugging. He also has specialized training and certifications in micro cross section preparation and analysis. Niche is Aerospace, defense, and medical.

David Molyneux has submitted responses to the following questions.

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling