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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
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Ask the Experts Member |
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David Molyneux
Sr. Process Engineer
TT Electronics
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David has 30 years of experience in electronics contract manufacturing, specializing in SMT. Extensive experience with pick and place, reflow profiling, screen printing, SPI, X-ray, stencil design, new equipment selection and validation, complex process debugging. He also has specialized training and certifications in micro cross section preparation and analysis. Niche is Aerospace, defense, and medical.
David Molyneux has submitted responses to the following questions.
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