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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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David Molyneux
Sr. Process Engineer
TT Electronics
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David has 30 years of experience in electronics contract manufacturing, specializing in SMT. Extensive experience with pick and place, reflow profiling, screen printing, SPI, X-ray, stencil design, new equipment selection and validation, complex process debugging. He also has specialized training and certifications in micro cross section preparation and analysis. Niche is Aerospace, defense, and medical.
David Molyneux has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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