| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
| Sponsor |
|
5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
|
|
Ask the Experts Member |
|
|
David Molyneux
Sr. Process Engineer
TT Electronics
|
David has 30 years of experience in electronics contract manufacturing, specializing in SMT. Extensive experience with pick and place, reflow profiling, screen printing, SPI, X-ray, stencil design, new equipment selection and validation, complex process debugging. He also has specialized training and certifications in micro cross section preparation and analysis. Niche is Aerospace, defense, and medical.
David Molyneux has submitted responses to the following questions.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
|
