Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Rakesh Kumar

Vice President of Technology

Specialty Coating Systems, Inc.

Dr. Rakesh Kumar is currently the V.P. of Technology for Specialty Coating Systems, Inc., where he leads the R&D group and manages Parylene R&D activities worldwide. He has more than 29 years of extensive experience in polymeric materials and their applications in the medical, electronics and semiconductors areas. He is currently involved with the application of Parylenes in the field of medical devices, electronics, MEMS, sensors, and nanotechnology.

Rakesh Kumar has submitted responses to the following questions.

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling