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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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P. Steve Calabria
Founder and CEO
PC Components Company
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Steve is a detail-oriented electronics engineer with 40+ years experience as a Quality Engineer in OCM, OEM, CM, and Distribution organizations. He has worked in defense, aerospace, and commercial sectors, and is the Founder of PC Components Company, a stocking distributor with more than a billion parts in its stock. Steve is a two-term past president and current Senior board member of the Independent Distributor's of Electronics Association (IDEA).
P. Steve Calabria has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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