Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

P. Steve Calabria

Founder and CEO

PC Components Company

Steve is a detail-oriented electronics engineer with 40+ years experience as a Quality Engineer in OCM, OEM, CM, and Distribution organizations. He has worked in defense, aerospace, and commercial sectors, and is the Founder of PC Components Company, a stocking distributor with more than a billion parts in its stock. Steve is a two-term past president and current Senior board member of the Independent Distributor's of Electronics Association (IDEA).

P. Steve Calabria has submitted responses to the following questions.

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling