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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
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Ask the Experts Member |
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Karl Pfluke
Sales Manager
KIC Thermal
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Karl has 20 years experience in electronics manufacturing to include solder paste printing/dispensing, pick & place, and a strong background in reflow.
Karl Pfluke has submitted responses to the following questions.
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