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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Tom Bergeron
Product Manager
KIC
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Tom Bergeron is a Product Manager at KIC with over 20 years of experience in the industry. He spent many years in Field Service and Technical Support assisting customers with troubleshooting, improving, and optimizing their thermal processes.
Tom Bergeron has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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