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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
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Ask the Experts Member |
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Larry Orr
Process Engineer
DRS
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Mr. Orr is has been a semiconductor professional for over 30 years working primarily in die attach and dicing technologies.
Larry Orr has submitted responses to the following questions.
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