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Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
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Watson Tseng
General Manager
SHENMAO America, Inc.
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Mr. Tseng currently leads the R&D team in development of solder paste and flux. He is involved in the approval of lead-free solder paste and flux from key accounts, and is responsible for solder paste and flux production lines in China and Germany.
Watson Tseng has submitted responses to the following questions.
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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