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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Ask the Experts Member |
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Watson Tseng
General Manager
SHENMAO America, Inc.
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Mr. Tseng currently leads the R&D team in development of solder paste and flux. He is involved in the approval of lead-free solder paste and flux from key accounts, and is responsible for solder paste and flux production lines in China and Germany.
Watson Tseng has submitted responses to the following questions.
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