Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Neil MacRaild

COO and Owner

Rapid Tooling Inc

Neil MacRaild is COO and owner of custom machining and tooling innovator, Rapid Tooling, Inc. With a broad engineering, sales and executive leadership background, MacRaild has spearheaded successful business development initiatives and operational turnarounds at some of the electronics industry's leading capital equipment, stencil, materials and tooling suppliers.

Neil MacRaild has submitted responses to the following questions.

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling