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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
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Circuit-Technology-Center

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
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Neil MacRaild


COO and Owner
Rapid Tooling Inc

Neil MacRaild is COO and owner of custom machining and tooling innovator, Rapid Tooling, Inc. With a broad engineering, sales and executive leadership background, MacRaild has spearheaded successful business development initiatives and operational turnarounds at some of the electronics industry's leading capital equipment, stencil, materials and tooling suppliers.

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Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
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