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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Ask the Experts Member |
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Greg Smith
Technical Field Applications
FCT Assembly/Fineline Stencil
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Greg has been in the SMT Stencil industry for 25 years. He supports customers technically with stencil design and root cause analysis to improve yield from print thru reflow.
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