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Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch
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Ask the Experts Member |
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Greg Smith
Technical Field Applications
FCT Assembly/Fineline Stencil
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Greg has been in the SMT Stencil industry for 25 years. He supports customers technically with stencil design and root cause analysis to improve yield from print thru reflow.
Greg Smith has submitted responses to the following questions.
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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