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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Greg Smith
Technical Field Applications
FCT Assembly/Fineline Stencil
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Greg has been in the SMT Stencil industry for 25 years. He supports customers technically with stencil design and root cause analysis to improve yield from print thru reflow.
Greg Smith has submitted responses to the following questions.
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