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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Tim Von Werne
Chief Technical Officer
Semblant
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Tim von Werne is responsible for the company's technical roadmap, Research and Development strategy and New Product and Process development. Prior to joining Semblant, Tim spent 7 years at Plastic Logic in Cambridge, where he was Director of Research, responsible for development of an innovative application of polymer thin film technology.
Tim Von Werne has submitted responses to the following questions.
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