How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils. BEST Inc.
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Affordable Excellence - iS6052 AOI
The latest addition to Viscom's esteemed lineup of AOI systems. This new system offers a compelling option for manufacturers looking to enhance their PCB inspection processes. Viscom
Tim von Werne is responsible for the company's technical roadmap, Research and Development strategy and New Product and Process development. Prior to joining Semblant, Tim spent 7 years at Plastic Logic in Cambridge, where he was Director of Research, responsible for development of an innovative application of polymer thin film technology.
Tim Von Werne has submitted responses to the following questions.
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Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements. Master Bond
