Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Tim Von Werne

Chief Technical Officer

Semblant

Tim von Werne is responsible for the company's technical roadmap, Research and Development strategy and New Product and Process development. Prior to joining Semblant, Tim spent 7 years at Plastic Logic in Cambridge, where he was Director of Research, responsible for development of an innovative application of polymer thin film technology.

Tim Von Werne has submitted responses to the following questions.

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling