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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Tim Von Werne
Chief Technical Officer
Semblant
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Tim von Werne is responsible for the company's technical roadmap, Research and Development strategy and New Product and Process development. Prior to joining Semblant, Tim spent 7 years at Plastic Logic in Cambridge, where he was Director of Research, responsible for development of an innovative application of polymer thin film technology.
Tim Von Werne has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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