Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

Sponsor

Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Marie Verdier

Application Manager

Inventec Performance Chemicals

Marie Verdier has a Masters of Chemistry and works for Inventec Performance Chemicals, a French-based supplier of solder pastes, soldering fluxes and cleaners for electronic applications around the world. Marie is a technical support engineer and has worked in a variety of technical roles: Testing new cleaners developed by Inventec and validate them, giving training to Inventec salesmen about cleaners, create presentations for seminars and conferences, technically supporting the salesmen by visiting customers, defining the best cleaning process and settling the cleaning process by customers from FRANCE to CHINA through Central Europe.

Marie Verdier has submitted responses to the following questions.

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling