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Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
SEIKA-America
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Manncorp

Outsourcing: A Risk You Can't Afford
Stop risking delays, tariffs, and rising costs with overseas PCB assembly. Bring production in-house with Manncorp for speed, precision, and total control—future-secured.
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Duane B. Mahnke


President
DBMahnke Consulting

Duane Mahnke is a materials expert having developed thin film dielectric and adhesive systems for various packaging, flex and rigid-flex applications. Hi is the chairman of IPC Flex Materials Test Methods Group and IPC UL 746F/796F Standards for Flex Materials and Flex And Flex Rigid Assemblies respectively. Manhnke is a recognized contributor for various IPC Flex Materials and Circuits Assembly Standards.

Duane B. Mahnke has submitted responses to the following questions.
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Nordson-ASYMTEK

ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
Uyemura