AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS
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Outsourcing: A Risk You Can't Afford
Stop risking delays, tariffs, and rising costs with overseas PCB assembly. Bring production in-house with Manncorp for speed, precision, and total control—future-secured. Manncorp Inc.
Duane Mahnke is a materials expert having developed thin film dielectric and adhesive systems for various packaging, flex and rigid-flex applications. Hi is the chairman of IPC Flex Materials Test Methods Group and IPC UL 746F/796F Standards for Flex Materials and Flex And Flex Rigid Assemblies respectively. Manhnke is a recognized contributor for various IPC Flex Materials and Circuits Assembly Standards.
Duane B. Mahnke has submitted responses to the following questions.
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ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield. Nordson Electronics Solutions