How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils. BEST Inc.
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Affordable Excellence - iS6052 AOI
The latest addition to Viscom's esteemed lineup of AOI systems. This new system offers a compelling option for manufacturers looking to enhance their PCB inspection processes. Viscom
Duane Mahnke is a materials expert having developed thin film dielectric and adhesive systems for various packaging, flex and rigid-flex applications. Hi is the chairman of IPC Flex Materials Test Methods Group and IPC UL 746F/796F Standards for Flex Materials and Flex And Flex Rigid Assemblies respectively. Manhnke is a recognized contributor for various IPC Flex Materials and Circuits Assembly Standards.
Duane B. Mahnke has submitted responses to the following questions.
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Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements. Master Bond
