Sponsor

How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils.
BEST Inc.

Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Ask the Experts Member

Duane B. Mahnke

President
DBMahnke Consulting

Duane Mahnke is a materials expert having developed thin film dielectric and adhesive systems for various packaging, flex and rigid-flex applications. Hi is the chairman of IPC Flex Materials Test Methods Group and IPC UL 746F/796F Standards for Flex Materials and Flex And Flex Rigid Assemblies respectively. Manhnke is a recognized contributor for various IPC Flex Materials and Circuits Assembly Standards.

Duane B. Mahnke has submitted responses to the following questions.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Trailblazing Process News for Conformal Coating
Say goodbye to clogged nozzles and hello to flawless conformal coating with the ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station.
Nordson Electronics Solutions