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Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch
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Ask the Experts Member |
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Duane B. Mahnke
President
DBMahnke Consulting
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Duane Mahnke is a materials expert having developed thin film dielectric and adhesive systems for various packaging, flex and rigid-flex applications. Hi is the chairman of IPC Flex Materials Test Methods Group and IPC UL 746F/796F Standards for Flex Materials and Flex And Flex Rigid Assemblies respectively. Manhnke is a recognized contributor for various IPC Flex Materials and Circuits Assembly Standards.
Duane B. Mahnke has submitted responses to the following questions.
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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