| Sponsor |
|
Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch
|
|
Ask the Experts Member |
|
|
Mike Bryant
VP R&D
BGF Industries
|
Worked in R&D, Tech Service and QC for BGF for 40+ years. Materials include glass fabrics, aramids, and carbon fiber. Much of this time spent working with glass fabrics for PCB applications and IPC.
Mike Bryant has submitted responses to the following questions.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
|
|
|
