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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Ask the Experts Member |
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Mike Bryant
VP R&D
BGF Industries
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Worked in R&D, Tech Service and QC for BGF for 40+ years. Materials include glass fabrics, aramids, and carbon fiber. Much of this time spent working with glass fabrics for PCB applications and IPC.
Mike Bryant has submitted responses to the following questions.
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Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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