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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Mike Bryant
VP R&D
BGF Industries
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Worked in R&D, Tech Service and QC for BGF for 40+ years. Materials include glass fabrics, aramids, and carbon fiber. Much of this time spent working with glass fabrics for PCB applications and IPC.
Mike Bryant has submitted responses to the following questions.
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