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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Mike Bryant
VP R&D
BGF Industries
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Worked in R&D, Tech Service and QC for BGF for 40+ years. Materials include glass fabrics, aramids, and carbon fiber. Much of this time spent working with glass fabrics for PCB applications and IPC.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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