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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Ask the Experts Member |
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Stephanie Castorina
Manager, Environmental Programs
IPC
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Stephanie Castorina has been the manager of environmental programs at the IPC since September 2008. She is responsible for monitoring environmental policies and communicating potential impacts to IPC members. She is responsible for representing IPC member interests at stakeholder and government agency meetings and serves as staff liaison to several IPC standards committees, including materials declaration management, low halogen, and conflict minerals.
Stephanie Castorina has submitted responses to the following questions.
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Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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