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Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Plasma-Etch
Sponsor
Circuit-Technology-Center

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

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Stephanie Castorina


Manager, Environmental Programs
IPC

Stephanie Castorina has been the manager of environmental programs at the IPC since September 2008. She is responsible for monitoring environmental policies and communicating potential impacts to IPC members. She is responsible for representing IPC member interests at stakeholder and government agency meetings and serves as staff liaison to several IPC standards committees, including materials declaration management, low halogen, and conflict minerals.

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Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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