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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Rocky Hilburn
Product Manager
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Microdrilling is a passion for Rocky Hilburn. His background and expertise encompasses: Test Methods for Flexible Circuits and Base Materials; Copper-Aluminum-Copper; Metallic substrate laminates; Embedded passives, resistive and capacitive materials and manufacturing; Electrodeposited and rolled annealed copper foils; Flexible substrates, adhesive and adhesiveless & vacuum deposition of metallics on dielectrics; Rigid, Rigid-Flex and flex PCB manufacturing; Military, aerospace and medical requirements for printed circuits
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