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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Outsourcing: A Risk You Can't Afford
Stop risking delays, tariffs, and rising costs with overseas PCB assembly. Bring production in-house with Manncorp for speed, precision, and total control—future-secured.
Manncorp Inc.
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Ask the Experts Member |
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Rocky Hilburn
Product Manager
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Microdrilling is a passion for Rocky Hilburn. His background and expertise encompasses: Test Methods for Flexible Circuits and Base Materials; Copper-Aluminum-Copper; Metallic substrate laminates; Embedded passives, resistive and capacitive materials and manufacturing; Electrodeposited and rolled annealed copper foils; Flexible substrates, adhesive and adhesiveless & vacuum deposition of metallics on dielectrics; Rigid, Rigid-Flex and flex PCB manufacturing; Military, aerospace and medical requirements for printed circuits
Rocky Hilburn has submitted responses to the following questions.
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ASYMTEK Select Coat SL-1040
The SL-1040 Conformal Coating System upgrades the SL-940 and added significant system-level advancements to elevate automation, control, precision & preventative maintenance for better yield.
Nordson Electronics Solutions
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