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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Rocky Hilburn
Product Manager
Insulectro
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Microdrilling is a passion for Rocky Hilburn. His background and expertise encompasses: Test Methods for Flexible Circuits and Base Materials; Copper-Aluminum-Copper; Metallic substrate laminates; Embedded passives, resistive and capacitive materials and manufacturing; Electrodeposited and rolled annealed copper foils; Flexible substrates, adhesive and adhesiveless & vacuum deposition of metallics on dielectrics; Rigid, Rigid-Flex and flex PCB manufacturing; Military, aerospace and medical requirements for printed circuits
Rocky Hilburn has submitted responses to the following questions.
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