| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
Ask the Experts Member |
|
|
Rocky Hilburn
Product Manager
Insulectro
|
Microdrilling is a passion for Rocky Hilburn. His background and expertise encompasses: Test Methods for Flexible Circuits and Base Materials; Copper-Aluminum-Copper; Metallic substrate laminates; Embedded passives, resistive and capacitive materials and manufacturing; Electrodeposited and rolled annealed copper foils; Flexible substrates, adhesive and adhesiveless & vacuum deposition of metallics on dielectrics; Rigid, Rigid-Flex and flex PCB manufacturing; Military, aerospace and medical requirements for printed circuits
Rocky Hilburn has submitted responses to the following questions.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
|
|
|
