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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
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Ask the Experts Member |
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Bill Vuono
Sr. Process Engineer
Raytheon Company
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Bill Vuono is currently responsible for cleaning, underfill, adhesives, and coating applications. He has a history with soldering specifications dating back to WS6536 (Navy). Currently he is co-chair of the Underfill Task Group, and section chair of the recently released Cleaning Handbook (CH-65).
Bill Vuono has submitted responses to the following questions.
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