| Sponsor |
|
Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
|
|
Ask the Experts Member |
|
|
Bill Vuono
Sr. Process Engineer
Raytheon Company
|
Bill Vuono is currently responsible for cleaning, underfill, adhesives, and coating applications. He has a history with soldering specifications dating back to WS6536 (Navy). Currently he is co-chair of the Underfill Task Group, and section chair of the recently released Cleaning Handbook (CH-65).
Bill Vuono has submitted responses to the following questions.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
