How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils. BEST Inc.
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Affordable Excellence - iS6052 AOI
The latest addition to Viscom's esteemed lineup of AOI systems. This new system offers a compelling option for manufacturers looking to enhance their PCB inspection processes. Viscom
Bill Vuono is currently responsible for cleaning, underfill, adhesives, and coating applications. He has a history with soldering specifications dating back to WS6536 (Navy). Currently he is co-chair of the Underfill Task Group, and section chair of the recently released Cleaning Handbook (CH-65).
Bill Vuono has submitted responses to the following questions.
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Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements. Master Bond
