| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
| Sponsor |
|
Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
|
|
Ask the Experts Member |
|
|
Bill Vuono
Sr. Process Engineer
Raytheon Company
|
Bill Vuono is currently responsible for cleaning, underfill, adhesives, and coating applications. He has a history with soldering specifications dating back to WS6536 (Navy). Currently he is co-chair of the Underfill Task Group, and section chair of the recently released Cleaning Handbook (CH-65).
Bill Vuono has submitted responses to the following questions.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
