| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
Ask the Experts Member |
|
|
Aidan Turnbull
Director, BOMcheck.net
ENVIRON
|
Dr Aidan Turnbull is a Partner at ENVIRON and leads the global WEEE, RoHS and EcoDesign Practice and the www.BOMcheck.net substances declarations web database system.
Aidan Turnbull has submitted responses to the following questions.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
|
|
|
