Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Russell Shepherd

Laboratory Director

Microtek Laboratories

Shepherd is a Laboratory Director at Microtek Laboratories. He has been in the PWB industry for over 25 years in both manufacturing and testing. Shepherd is a certified MIT Trainer in IPC-A-600 and IPC-A-610. He is also Chairman of IPC-TM-650 Microsection subcommittee.

Russell Shepherd has submitted responses to the following questions.

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling