Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering. BEST Inc.
Shepherd is a Laboratory Director at Microtek Laboratories. He has been in the PWB industry for over 25 years in both manufacturing and testing. Shepherd is a certified MIT Trainer in IPC-A-600 and IPC-A-610. He is also Chairman of IPC-TM-650 Microsection subcommittee.
Russell Shepherd has submitted responses to the following questions.
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS
