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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

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Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

Ask the Experts Member

John S. Wasyliw

VP of Engineering
APS Novastar LLC

John Wasyliw is VP of Engineering with over 20 years of experience in complex mechanical and motion design including control and software development. He is currently responsible for all product engineering, new product development and commercialization for APS Novastar LLC.

John S. Wasyliw has submitted responses to the following questions.

Batch Reflow vs. In-line Reflow
Assuming that all things are equal, which would be the better option, a conveyor type oven or a batch type? ...

Board Spacing During Reflow
Your first objective should be to obtain consistent thermal repeatability or uniform heating across your boards. The ovens today are ...

Reflow oven testing and calibrating concern
I am not aware of any industry standard test board or recommended pad location test points. There is a JEDEC ...

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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS