| Sponsor |
|
Optically Clear, Nanosilica Filled Epoxy
Master Bond EP114 is a NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.
Master Bond
|
|
Ask the Experts Member |
|
|
John S. Wasyliw
VP of Engineering
APS Novastar LLC
|
John Wasyliw is VP of Engineering with over 20 years of experience in complex mechanical and motion design including control and software development. He is currently responsible for all product engineering, new product development and commercialization for APS Novastar LLC.
John S. Wasyliw has submitted responses to the following questions.
Board Spacing During Reflow
Your first objective should be to obtain consistent thermal repeatability or uniform heating across your boards. The ovens today are ...
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Reliable drying of UV materials
Rehm Thermal Systems launches the RDS UV dryer to meet faster hardening demands, enabling efficient, eco-friendly UV coating for electronics and various industries.
Rehm Thermal Systems
|
|
|
