| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
| Sponsor |
|
SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
|
|
Ask the Experts Member |
|
|
John S. Wasyliw
VP of Engineering
APS Novastar LLC
|
John Wasyliw is VP of Engineering with over 20 years of experience in complex mechanical and motion design including control and software development. He is currently responsible for all product engineering, new product development and commercialization for APS Novastar LLC.
John S. Wasyliw has submitted responses to the following questions.
Board Spacing During Reflow
Your first objective should be to obtain consistent thermal repeatability or uniform heating across your boards. The ovens today are ...
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
|
|
|
