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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
Ormet® TLPS
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Ask the Experts Member |
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John S. Wasyliw
VP of Engineering
APS Novastar LLC
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John Wasyliw is VP of Engineering with over 20 years of experience in complex mechanical and motion design including control and software development. He is currently responsible for all product engineering, new product development and commercialization for APS Novastar LLC.
John S. Wasyliw has submitted responses to the following questions.
Board Spacing During Reflow
Your first objective should be to obtain consistent thermal repeatability or uniform heating across your boards. The ovens today are ...
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