Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Ask the Experts Member

Jess Baker

President
RPS Automation

Jess Baker has been in manufacturing management positions for over 47 years. He is the President and founder of Repco Inc., and Robotic Process Systems. He is currently President of RPS Automation a manufacturer of Selective Soldering, and Solderability Test Equipment.

Jess Baker has submitted responses to the following questions.

Hand Soldering vs. Selective Wave for small LCD
Millions upon millions of LCD displays have been selectively soldered using both mass-selective wave and miniature-selective wave (drag) soldering process. ...

Carbon Dioxide generated and trapped by conformal coating
I don't pretend to be an expert on this; however there are several reasons for cause for alarm in my ...

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Sponsor

Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.