Sponsor

Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling, making it suitable for applications where low stress is critical.
Master Bond

Sponsor

Capital Expenses Significantly Reduced by Eliminating Dispensed Adhesives and Underfills
Learn how you can potentially save $300K-$900K in capital expense with our PLACE-N-BOND Underfilms. Click here.
Alltemated Inc.

Ask the Experts Member

Jess Baker

President
RPS Automation

Jess Baker has been in manufacturing management positions for over 47 years. He is the President and founder of Repco Inc., and Robotic Process Systems. He is currently President of RPS Automation a manufacturer of Selective Soldering, and Solderability Test Equipment.

Jess Baker has submitted responses to the following questions.

Hand Soldering vs. Selective Wave for small LCD
Millions upon millions of LCD displays have been selectively soldered using both mass-selective wave and miniature-selective wave (drag) soldering process. ...

Carbon Dioxide generated and trapped by conformal coating
I don't pretend to be an expert on this; however there are several reasons for cause for alarm in my ...

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Sponsor

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies