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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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Ask the Experts Member |
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Jess Baker
President
RPS Automation
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Jess Baker has been in manufacturing management positions for over 47 years. He is the President and founder of Repco Inc., and Robotic Process Systems. He is currently President of RPS Automation a manufacturer of Selective Soldering, and Solderability Test Equipment.
Jess Baker has submitted responses to the following questions.
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