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Webinar on 10/30 at 11:00 AM PT
Free Webinar: Learn what's new in the IPC-6012 Space Addendum featuring key updates, best design practices, and reliability.
Summit Interconnect

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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Ask the Experts Member

Jess Baker

President
RPS Automation

Jess Baker has been in manufacturing management positions for over 47 years. He is the President and founder of Repco Inc., and Robotic Process Systems. He is currently President of RPS Automation a manufacturer of Selective Soldering, and Solderability Test Equipment.

Jess Baker has submitted responses to the following questions.

Hand Soldering vs. Selective Wave for small LCD
Millions upon millions of LCD displays have been selectively soldered using both mass-selective wave and miniature-selective wave (drag) soldering process. ...

Carbon Dioxide generated and trapped by conformal coating
I don't pretend to be an expert on this; however there are several reasons for cause for alarm in my ...

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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS