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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation
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Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
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Ask the Experts Member |
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Giancarlo De La Garza
Sales
Nordson YESTech
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Giancarlo De La Garza has more than 7 years of expertice as a service / applications egineer in the AOI and X ray industry.
Giancarlo De La Garza has submitted responses to the following questions.
AOI or X-Ray inspection?
Both technologies compliment each other. It is very basic, if you can not see it then you need Xray, depending ...
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