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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Kent Dixon
VP Sales - Americas
Cencorp
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Mr. Dixon heads sales in North and South America for Cencorp. Kent holds a BS in mechanical engineering and has been with Cencorp for 8 years. Automated solutions for depaneling, test handling and odd-form placement are Kent's area of expertise.
Kent Dixon has submitted responses to the following questions.
PCB Singulation
PCB singulation refers to the process of removing individual pcbs from a panel where there may be multiple pcbs in ...
Depaneling equipment
The primary technologies used for depaneling are routing, sawing, shearing, and punching.
Routing and punching are suitable for panels designed ...
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