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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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Ask the Experts Member |
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Kent Dixon
VP Sales - Americas
Cencorp
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Mr. Dixon heads sales in North and South America for Cencorp. Kent holds a BS in mechanical engineering and has been with Cencorp for 8 years. Automated solutions for depaneling, test handling and odd-form placement are Kent's area of expertise.
Kent Dixon has submitted responses to the following questions.
PCB Singulation
PCB singulation refers to the process of removing individual pcbs from a panel where there may be multiple pcbs in ...
Depaneling equipment
The primary technologies used for depaneling are routing, sawing, shearing, and punching.
Routing and punching are suitable for panels designed ...
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