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Need a Profiler Plan B?
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ECD
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Seven Facilities, One Trusted Source
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Ask the Experts Member |
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Kent Dixon
VP Sales - Americas
Cencorp
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Mr. Dixon heads sales in North and South America for Cencorp. Kent holds a BS in mechanical engineering and has been with Cencorp for 8 years. Automated solutions for depaneling, test handling and odd-form placement are Kent's area of expertise.
Kent Dixon has submitted responses to the following questions.
PCB Singulation
PCB singulation refers to the process of removing individual pcbs from a panel where there may be multiple pcbs in ...
Depaneling equipment
The primary technologies used for depaneling are routing, sawing, shearing, and punching.
Routing and punching are suitable for panels designed ...
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Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions
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