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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
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pH Employment in Electronic Cleaning
The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Download now.
KYZEN
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Ask the Experts Member |
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Kent Dixon
VP Sales - Americas
Cencorp
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Mr. Dixon heads sales in North and South America for Cencorp. Kent holds a BS in mechanical engineering and has been with Cencorp for 8 years. Automated solutions for depaneling, test handling and odd-form placement are Kent's area of expertise.
Kent Dixon has submitted responses to the following questions.
PCB Singulation
PCB singulation refers to the process of removing individual pcbs from a panel where there may be multiple pcbs in ...
Depaneling equipment
The primary technologies used for depaneling are routing, sawing, shearing, and punching.
Routing and punching are suitable for panels designed ...
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You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH
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