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One Component, Fast Curing Epoxy
Master Bond EP4EN-80 is a NASA low outgassing approved adhesive for potting and encapsulation. It cures at 80°C and features thermal conductivity and electrical insulation.
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Ask the Experts Member |
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Kent Dixon
VP Sales - Americas
Cencorp
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Mr. Dixon heads sales in North and South America for Cencorp. Kent holds a BS in mechanical engineering and has been with Cencorp for 8 years. Automated solutions for depaneling, test handling and odd-form placement are Kent's area of expertise.
Kent Dixon has submitted responses to the following questions.
PCB Singulation
PCB singulation refers to the process of removing individual pcbs from a panel where there may be multiple pcbs in ...
Depaneling equipment
The primary technologies used for depaneling are routing, sawing, shearing, and punching.
Routing and punching are suitable for panels designed ...
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The Smart Alternative to SAC305
Get the cost benefits of a low-silver solution without sacrificing quality. REL61 surpasses SAC305 in key tests like AOI performance—making it the smart choice for your operations.
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