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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation
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Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
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Ask the Experts Member |
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Andrew Joos
VP of Business Development
X-Line Asset Management
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Mr. Joos is responsible for all customer-facing activities for X-line Asset Management including sales and business development. He brings 10+ years of experience selling new, high-tech capital equipment to contract manufacturers, OEMs, and equipment dealers.
Andrew Joos has submitted responses to the following questions.
AOI or X-Ray inspection?
When considering new or used inspection equipment for you facility you must first determine your basic needs. AOI and X-Ray ...
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