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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Andrew Joos
VP of Business Development
X-Line Asset Management
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Mr. Joos is responsible for all customer-facing activities for X-line Asset Management including sales and business development. He brings 10+ years of experience selling new, high-tech capital equipment to contract manufacturers, OEMs, and equipment dealers.
Andrew Joos has submitted responses to the following questions.
AOI or X-Ray inspection?
When considering new or used inspection equipment for you facility you must first determine your basic needs. AOI and X-Ray ...
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