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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Ask the Experts Member

Michael Kirschner

President
Design Chain Associates, LLC

Mr. Kirschner is President of Design Chain Associates, LLC, focused on helping electronics OEMs comply with RoHS/WEEE requirements, and speeding time-to-market, reducing product cost, and increasing engineering and procurement efficiency.

Michael Kirschner has submitted responses to the following questions.

Can Solder Joint Geometry Change Resistance?
Why would higher resistance - presumably in series with the battery powered unit - result in higher current? Higher resistance ...

Leaded Solder on ROHS Compliant Parts
If the product is supposed to be RoHS-compliant then yes, it is a potential legal problem because it may no ...

Halogen Free PCB legislation
Outside of San Francisco, there is no current legislation or regulation (and there is no such thing as 'global legislation' ...

RoHS exemption for agricultural equipment in Europe
EU RoHS does not apply to electrical and electronic products specifically intended for vehicles. The FAQ, recently updated, non-binding, and ...

RoHS compliance for SMT and Through-hole equipment
Depends on what the equipment is and what category (as defined in the WEEE directive and referenced in the RoHS ...

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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated