| Sponsor |
|
AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
|
|
| Sponsor |
|
PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
|
|
Ask the Experts Member |
|
|
Ted Marek
President
SMT Sales Associates Inc
|
Mr. Marek is the Founder and President of SMT Sales Associates Inc. SMT is a distributor and manufacturer's representative organization in the PCB assembly marketplace. He has over 11 years experience helping customers select soldering materials and capital equipment.
Ted Marek has submitted responses to the following questions.
BGA re-balling process
We sell a fixture for reballing BGA's one at a time. You apply liquid flux to the bottom of the ...
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
