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Eliminate Lead Tinning Issues Before They Become Reliability Failures
Learn lead tinning methods, causes of tinning defects, and solutions from the experts at Circuit Technology Center to help ensure dependable solder connections.
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Ask the Experts Member

Michael O'Hanlon

Applications Supervisor
DEK

Mr. O'Hanlon serves as the DEK Applications Supervisor for the Americas region. He has over 20 years of electronics manufacturing experience and has spent the last 13 years at DEK providing equipment utilization and process solutions for SMT manufacturing.

Michael O'Hanlon has submitted responses to the following questions.

Solder Paste Replenishment
Rule of thumb is to maintain a paste bead of 0.5 to 0.75 inches high. The first symptom of low ...

Stencil printing process problems
First, ensure the paste bead size is being managed properly. Too little paste will exasperate this issue. Of course too ...

Solder Paste Inspection
Your first task is to identify your end goal. What is it you, or your customer, what inspected? Then, ask ...

Screen printing QNF24 problem
I'm assuming the reason you changed to the process you describe is because a normal "On Contact " process caused ...

Lead-free soldering problem
Answer to Question 1 It is possible the root cause of your problem is insufficient paste. Assuming you're running a ...

Double sided SMT
Do not underestimate the importance of proper board support for your double sided application. First and foremost, a robust SMT ...

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How pH Cleaning Agents Affect Production Performance
Establishing a reliable cleaning process requires a good understanding of all influencing factors, including pH, and defining the correct balance to meet final product reliability.
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