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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Christopher Perry
Worldwide Sales & Marketing Manager
EMC Global Technologies, Inc.
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Mr. Perry has been with EMC for 12 Years, working with cleaning and tooling applications used in electronic manufacturing environments. EMC produces all types of solvent and aqueous cleaners for stencils, misprints and fluxed boards.
Christopher Perry has submitted responses to the following questions.
PCB Cleaning
Actually, it's just the opposite. Hand wiping misprinted boards has a negative impact on the cleaning process. This allows solder ...
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