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Webinar on 10/30 at 11:00 AM PT
Free Webinar: Learn what's new in the IPC-6012 Space Addendum featuring key updates, best design practices, and reliability.
Summit Interconnect
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Ask the Experts Member |
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Christopher Perry
Worldwide Sales & Marketing Manager
EMC Global Technologies, Inc.
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Mr. Perry has been with EMC for 12 Years, working with cleaning and tooling applications used in electronic manufacturing environments. EMC produces all types of solvent and aqueous cleaners for stencils, misprints and fluxed boards.
Christopher Perry has submitted responses to the following questions.
PCB Cleaning
Actually, it's just the opposite. Hand wiping misprinted boards has a negative impact on the cleaning process. This allows solder ...
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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