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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK

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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Ask the Experts Member

Dr. Harald Wack

Executive Vice President and CEO
Zestron America

Harald Wack hsa a doctoral degree in organic chemistry, an author of 10+ published scientific articles in organic chemistry as well as numerous publications within the electronics industry. He is currently the Executive Vice President and CEO of Zestron America.

Dr. Harald Wack has submitted responses to the following questions.

Cleaning tin-lead and lead-free boards
You can use the same equipment for eutectic and lead free, given that the chemistry you choose has the capability ...

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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.