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Advanced-Interconnections

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
kyzen
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Viscom-SE

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE

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Dr. Harald Wack


Executive Vice President and CEO
Zestron America

Harald Wack hsa a doctoral degree in organic chemistry, an author of 10+ published scientific articles in organic chemistry as well as numerous publications within the electronics industry. He is currently the Executive Vice President and CEO of Zestron America.

Dr. Harald Wack has submitted responses to the following questions.
Cleaning tin-lead and lead-free boards
You can use the same equipment for eutectic and lead free, given that the chemistry you choose has the capability ...
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Sponsor
Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Uyemura