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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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Ask the Experts Member |
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Yun Zhang
R&D Director
Cookson Electronics, Enthone
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Ms. Zhang has a PhD in chemistry/electrochemistry. Experiences include AT&T/Lucent Bell Labs, Technic, Cookson Electronics/Enthone. Areas of expertise include: electroplating; Sn whiskers, wafer bumping, Cu post/pillar, Cu redistribution lines and Sn and SnAg bumps.
Yun Zhang has submitted responses to the following questions.
Tin Whiskers
Vacuum would help but will not prevent it.
The only way to prevent whisker growth under any condition is to ...
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