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Ask the Experts Member |
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Yun Zhang
R&D Director
Cookson Electronics, Enthone
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Ms. Zhang has a PhD in chemistry/electrochemistry. Experiences include AT&T/Lucent Bell Labs, Technic, Cookson Electronics/Enthone. Areas of expertise include: electroplating; Sn whiskers, wafer bumping, Cu post/pillar, Cu redistribution lines and Sn and SnAg bumps.
Yun Zhang has submitted responses to the following questions.
Tin Whiskers
Vacuum would help but will not prevent it.
The only way to prevent whisker growth under any condition is to ...
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Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
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