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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Yun Zhang
R&D Director
Cookson Electronics, Enthone
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Ms. Zhang has a PhD in chemistry/electrochemistry. Experiences include AT&T/Lucent Bell Labs, Technic, Cookson Electronics/Enthone. Areas of expertise include: electroplating; Sn whiskers, wafer bumping, Cu post/pillar, Cu redistribution lines and Sn and SnAg bumps.
Yun Zhang has submitted responses to the following questions.
Tin Whiskers
Vacuum would help but will not prevent it.
The only way to prevent whisker growth under any condition is to ...
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Our Solutions
Discover Essegi Automation's modular solutions: flexible hardware and software seamlessly integrated into SMT and THT environments.
Essegi Automation
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