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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Ask the Experts Member |
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Yun Zhang
R&D Director
Cookson Electronics, Enthone
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Ms. Zhang has a PhD in chemistry/electrochemistry. Experiences include AT&T/Lucent Bell Labs, Technic, Cookson Electronics/Enthone. Areas of expertise include: electroplating; Sn whiskers, wafer bumping, Cu post/pillar, Cu redistribution lines and Sn and SnAg bumps.
Yun Zhang has submitted responses to the following questions.
Tin Whiskers
Vacuum would help but will not prevent it.
The only way to prevent whisker growth under any condition is to ...
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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