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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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Dr. Rita Mohanty


Director Advanced Development
Speedline Technologies

Dr. Mohanty, PhD in Chemical Engineering, has over fifteen years experience in both industry and academic relating to engineering and electronic polymers, electronic packaging and assembly. She has experience in SMT process optimization and Lead-free transition.

Dr. Rita Mohanty has submitted responses to the following questions.
Reflow for leaded and lead-free assemblies
It is not critical at all. Unlike Wave soldering which is an additive process where solder is added to processed ...
Stencil Aperture Ratio
The best answer to this question is "it depends"... It depends on the type of paste (Type III, IV etc...), ...
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Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Uyemura