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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Dr. Rita Mohanty
Director Advanced Development
Speedline Technologies
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Dr. Mohanty, PhD in Chemical Engineering, has over fifteen years experience in both industry and academic relating to engineering and electronic polymers, electronic packaging and assembly. She has experience in SMT process optimization and Lead-free transition.
Dr. Rita Mohanty has submitted responses to the following questions.
Stencil Aperture Ratio
The best answer to this question is "it depends"...
It depends on the type of paste (Type III, IV etc...), ...
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