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AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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Adhesives for Tomorrow's Electronics
Dymax UV/LED curable adhesives, dispensers & curing equipment provide bonding and protection solutions for PCBs and board-level components. Learn how!
Dymax
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Ask the Experts Member |
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Jean-Marc Peallat
Products & Applications Mgr
Vi Technology
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Jean-Marc Peallat is Products and Applications Manager for Vi Technology. He started the AOI branch of the company, ten years ago, and led successively support and application teams, notably in Americas.
Jean-Marc Peallat has submitted responses to the following questions.
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
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