| Sponsor |
|
Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
|
|
| Sponsor |
|
Inline Automatic X-Ray Inspection: TruViewâ„¢ Verus
TruViewâ„¢ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
|
|
Ask the Experts Member |
|
|
Jean-Marc Peallat
Products & Applications Mgr
Vi Technology
|
Jean-Marc Peallat is Products and Applications Manager for Vi Technology. He started the AOI branch of the company, ten years ago, and led successively support and application teams, notably in Americas.
Jean-Marc Peallat has submitted responses to the following questions.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
