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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation
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Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
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Ask the Experts Member |
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Jean-Marc Peallat
Products & Applications Mgr
Vi Technology
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Jean-Marc Peallat is Products and Applications Manager for Vi Technology. He started the AOI branch of the company, ten years ago, and led successively support and application teams, notably in Americas.
Jean-Marc Peallat has submitted responses to the following questions.
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