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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation
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Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
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Steve DeCollibus
Managing Editor
Circuitnet
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Throughout his career Mr. DeCollibus has successfully implemented global marketing communications and brand development initiatives for some of the electronics industry's top companies. He is currently managing editor of Circuitnet and Semiconductor Packaging News. NOTE: Mr. DeCollibus is no longer working at Circuitnet.
Steve DeCollibus has submitted responses to the following questions.
APEX Trade Show Feedback
From our perspective the show was a good one, while we were not prepared to sing,"Happy days are here again", ...
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