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AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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Adhesives for Tomorrow's Electronics
Dymax UV/LED curable adhesives, dispensers & curing equipment provide bonding and protection solutions for PCBs and board-level components. Learn how!
Dymax
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Ask the Experts Member |
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Steve DeCollibus
Managing Editor
Circuitnet
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Throughout his career Mr. DeCollibus has successfully implemented global marketing communications and brand development initiatives for some of the electronics industry's top companies. He is currently managing editor of Circuitnet and Semiconductor Packaging News. NOTE: Mr. DeCollibus is no longer working at Circuitnet.
Steve DeCollibus has submitted responses to the following questions.
APEX Trade Show Feedback
From our perspective the show was a good one, while we were not prepared to sing,"Happy days are here again", ...
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Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
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