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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Sponsor

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

Ask the Experts Member

Jeff Fouche

Design Engineer
ACE Production Technologies

Jeff Fouche has 2 years of experience as a Manufacturing Engineer for CM/OEM and 2 years as a Design/Process Engineer with ACE Production Technologies. Jeff is also an IPC certified trainer. He received his BSME in 2003 from the University of Idaho.
NOTE: Mr. Fouche is no longer working at ACE production Technologies.

Jeff Fouche has submitted responses to the following questions.

Hand Soldering vs. Selective Wave for small LCD
Based simply on the peak temperature a PCB experiences during selective soldering, I can confidently say that you will not ...

Increase bed life with in-line cleaner
There are a few things that you can do for free with your existing system to improve the life of ...

Wetting Problem SAC finished component
Although I cannot speak much to the SMT side of you question, I do have some comments regarding the tinning ...

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Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.