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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Claudio Orefice
President
High-Tech Conversions Inc.
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Claudio Orefice is president of High-Tech Conversions. They manufacture a variety of wiping products and can supply virtually any type of consumable item used in cleanrooms, assembly lines, laboratories and manufacturing
Claudio Orefice has submitted responses to the following questions.
Hand Soldering Alternative
In order to improve output on a hand soldering project, experts recommend doing two things...
You need to make sure ...
Stencil Cleaning Alternatives
Ultrasonic stencil cleaners are still the industry standard for cleaning paste from apertures in stencils, but what is changing is ...
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