Sponsor

The Battle for Space Superiority Has Begun
The next conflict may begin in orbit. Learn why resilient space systems and advanced manufacturing matter more than ever.
Summit Interconnect

Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Ask the Experts Member

Claudio Orefice

President
High-Tech Conversions Inc.

Claudio Orefice is president of High-Tech Conversions. They manufacture a variety of wiping products and can supply virtually any type of consumable item used in cleanrooms, assembly lines, laboratories and manufacturing

Claudio Orefice has submitted responses to the following questions.

Hand Soldering Alternative
In order to improve output on a hand soldering project, experts recommend doing two things... You need to make sure ...

Stencil Cleaning Alternatives
Ultrasonic stencil cleaners are still the industry standard for cleaning paste from apertures in stencils, but what is changing is ...

Cleaning methodology and options
I suggest you use a degreaser, we have one in a spray can that removes oil, grease, flux and a ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond