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One Component, Fast Curing Epoxy
Master Bond EP4EN-80 is a NASA low outgassing approved adhesive for potting and encapsulation. It cures at 80°C and features thermal conductivity and electrical insulation.
Master Bond
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Ask the Experts Member |
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Gary Bowman
Sales Manager
Krayden, Inc.
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Gary Bowman has been in distribution sales for 33 years selling into Electronic, Aerospace, Medical and OEM market place. Bowman has been with Krayden for 18 years.
Gary Bowman has submitted responses to the following questions.
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The Smart Alternative to SAC305
Get the cost benefits of a low-silver solution without sacrificing quality. REL61 surpasses SAC305 in key tests like AOI performancemaking it the smart choice for your operations.
AIM Solder
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