Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Sponsor

Reduce Electronics Costs with Strategic Component Recovery
Recovering valuable electronic components can help manufacturers lower expenses, minimize waste, and extend the life of critical inventory. Learn practical methods.
Circuit Technology Center

Ask the Experts Member

Andrew Brinks

Electronics Product Technical Specialist
Dow Corning

Andrew Brinks is a silicone specialist at Dow Corning. He specializes in silicone electronic materials including conformal coatings, encapsulants, gels, adhesives, and microelectronics materials. He has both a bachelor's degree in Mechanical Engineering and an MBA from Michigan Technological University.

Andrew Brinks has submitted responses to the following questions.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio