Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Andrew Brinks

Electronics Product Technical Specialist

Dow Corning

Andrew Brinks is a silicone specialist at Dow Corning. He specializes in silicone electronic materials including conformal coatings, encapsulants, gels, adhesives, and microelectronics materials. He has both a bachelor's degree in Mechanical Engineering and an MBA from Michigan Technological University.

Andrew Brinks has submitted responses to the following questions.

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling