Sponsor

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS

Sponsor

Reduce Electronics Costs with Strategic Component Recovery
Recovering valuable electronic components can help manufacturers lower expenses, minimize waste, and extend the life of critical inventory. Learn practical methods.
Circuit Technology Center

Ask the Experts Member

Brandon Judd

Technical Support Engineer
Indium Corporation

Brandon is a Technical Support Engineer supporting Indium's advanced SMT materials, including solder pastes, thermal interface materials, and engineered solders. He specializes in the optimization of SMT lines, including stencil printing parameters and reflow oven profiling.

Brandon Judd has submitted responses to the following questions.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio