Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more. Plasma Etch
Brandon is a Technical Support Engineer supporting Indium's advanced SMT materials, including solder pastes, thermal interface materials, and engineered solders. He specializes in the optimization of SMT lines, including stencil printing parameters and reflow oven profiling.
Brandon Judd has submitted responses to the following questions.
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling. Advanced Interconnections Corp
