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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Brandon Judd
Technical Support Engineer
Indium Corporation
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Brandon is a Technical Support Engineer supporting Indium's advanced SMT materials, including solder pastes, thermal interface materials, and engineered solders. He specializes in the optimization of SMT lines, including stencil printing parameters and reflow oven profiling.
Brandon Judd has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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